DocumentCode
626972
Title
A low-power area-efficient compressive sensing approach for multi-channel neural recording
Author
Shoaran, Mahsa ; Lopez, Miriam M. ; Pasupureddi, Vijaya Sankara Rao ; Leblebici, Yusuf ; Schmid, A.
Author_Institution
Microelectron. Syst. Lab. (LSM), Swiss Fed. Inst. of Technol. (EPFL), Lausanne, Switzerland
fYear
2013
fDate
19-23 May 2013
Firstpage
2191
Lastpage
2194
Abstract
High-density wireless intracranial neural recording is a promising technology enabling the autonomous diagnosis and therapy of brain diseases. Increasing the number of recording channels is accompanied by the increased amount of data resulting in an unacceptable transmission power. A comprehensive study of possible compressed sensing methods in the context of neural signals has been done, and the compression of signals originating from different channels in the spatial domain has been implemented at the system and circuit levels. Results of the simulations in a UMC 0.18μm CMOS technology and subsequent reconstructions show the possibility of compressing with ratios as high as 2.6 with a recovery SNR of at least 10dB using extremely compact and low-power circuits. The power efficiency and limited area per channel confirm the relevance of the proposed approach for multi-channel high-density neural interfaces.
Keywords
CMOS integrated circuits; brain; circuit simulation; compressed sensing; data recording; diseases; low-power electronics; medical signal processing; patient diagnosis; patient treatment; signal reconstruction; SNR; UMC CMOS technology; brain disease diagnosis; brain disease therapy; high-density wireless intracranial multichannel neural recording channel; low-power area-efficient compressive sensing approach; low-power circuit; multichannel high-density neural interface; signals compression; signals reconstruction; size 0.18 mum; unacceptable transmission power; Arrays; Capacitors; Compressed sensing; Generators; Random sequences; Signal to noise ratio; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location
Beijing
ISSN
0271-4302
Print_ISBN
978-1-4673-5760-9
Type
conf
DOI
10.1109/ISCAS.2013.6572310
Filename
6572310
Link To Document