Title :
A model based comparison of BiFeO3 device applicability in neuromorphic hardware
Author :
Cederstrom, Love ; Starke, Paul ; Mayr, Christian ; Yao Shuai ; Schmid, Heinz ; Schuffny, Rene
Author_Institution :
Zentrum Mikroelektron. Dresden AG, Dresden, Germany
Abstract :
Two terminal devices with switchable resistance have been of interest to electrical engineers for a long time, but only in the last few years has this attracted widespread attention. Recently a BiFeOe (BFO) capacitor-like metal-insulator-metal (MIM) structure was proposed as a synthetic synapse in neuromorphic systems, implementing voltage waveform driven spike timing dependent plasticity (STDP). Using a new device model that faithfully reproduces measurements of BFO-MIM structures we analyze how the switching characteristic affects the STDP learning window. Our simulations indicate that the gradual increase in the resistance change of BFO MIM structures result in a robust STDP with a biologically realistic learning window, whereas a distinct threshold followed by a steep hysteresis curve produce a narrow learning window and inflict strict operating conditions. Therefore we conclude that the steepness of the current voltage hysteresis curve is a fundamental characteristic to consider when designing synthetic synapses for neuromorphic hardware.
Keywords :
MIM devices; bismuth compounds; capacitors; electric resistance; hysteresis; learning (artificial intelligence); neurophysiology; BFO-MIM structures; STDP learning window; biologically realistic learning window; capacitor-like MIM structure; capacitor-like metal-insulator-metal structure; current voltage hysteresis curve; electrical engineers; neuromorphic hardware; steep hysteresis curve; switchable resistance; switching characteristics; synthetic synapse; voltage waveform driven spike timing dependent plasticity; Adaptation models; Biological system modeling; Hardware; Memristors; Neuromorphics; Neurons; Switches; STDP; device model; memristive device; memristor; neuromorphic systems; synthetic synapse;
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5760-9
DOI :
10.1109/ISCAS.2013.6572343