DocumentCode
627763
Title
A floorplan method for ASIC designs of asynchronous circuits with bundled-data implementation
Author
Iizuka, Masataka ; Saito, Hiroshi
Author_Institution
Univ. of Aizu, Aizu-Wakamatsu, Japan
fYear
2013
fDate
16-19 June 2013
Firstpage
1
Lastpage
4
Abstract
This study proposes a floorplan method for asynchronous circuits with bundled-data implementation to support ASIC designs. The proposed method based on Simulated Annealing (SA) and sequence-pair minimizes both latency and chip size of bundled-data Implementation considering setup constraints. In the experiments, the floorplan results obtained by the proposed method are evaluated in terms of latency and chip size by changing parameters of SA and weights for latency and chip size.
Keywords
application specific integrated circuits; asynchronous circuits; integrated circuit design; integrated circuit layout; simulated annealing; ASIC designs; SA; asynchronous circuits; bundled-data implementation; chip size; floorplan method; latency; sequence-pair; setup constraints; simulated annealing; Asynchronous circuits; Delays; Layout; Minimization; Registers; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
Conference_Location
Paris
Print_ISBN
978-1-4799-0618-5
Type
conf
DOI
10.1109/NEWCAS.2013.6573596
Filename
6573596
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