• DocumentCode
    627763
  • Title

    A floorplan method for ASIC designs of asynchronous circuits with bundled-data implementation

  • Author

    Iizuka, Masataka ; Saito, Hiroshi

  • Author_Institution
    Univ. of Aizu, Aizu-Wakamatsu, Japan
  • fYear
    2013
  • fDate
    16-19 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This study proposes a floorplan method for asynchronous circuits with bundled-data implementation to support ASIC designs. The proposed method based on Simulated Annealing (SA) and sequence-pair minimizes both latency and chip size of bundled-data Implementation considering setup constraints. In the experiments, the floorplan results obtained by the proposed method are evaluated in terms of latency and chip size by changing parameters of SA and weights for latency and chip size.
  • Keywords
    application specific integrated circuits; asynchronous circuits; integrated circuit design; integrated circuit layout; simulated annealing; ASIC designs; SA; asynchronous circuits; bundled-data implementation; chip size; floorplan method; latency; sequence-pair; setup constraints; simulated annealing; Asynchronous circuits; Delays; Layout; Minimization; Registers; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4799-0618-5
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2013.6573596
  • Filename
    6573596