DocumentCode :
627763
Title :
A floorplan method for ASIC designs of asynchronous circuits with bundled-data implementation
Author :
Iizuka, Masataka ; Saito, Hiroshi
Author_Institution :
Univ. of Aizu, Aizu-Wakamatsu, Japan
fYear :
2013
fDate :
16-19 June 2013
Firstpage :
1
Lastpage :
4
Abstract :
This study proposes a floorplan method for asynchronous circuits with bundled-data implementation to support ASIC designs. The proposed method based on Simulated Annealing (SA) and sequence-pair minimizes both latency and chip size of bundled-data Implementation considering setup constraints. In the experiments, the floorplan results obtained by the proposed method are evaluated in terms of latency and chip size by changing parameters of SA and weights for latency and chip size.
Keywords :
application specific integrated circuits; asynchronous circuits; integrated circuit design; integrated circuit layout; simulated annealing; ASIC designs; SA; asynchronous circuits; bundled-data implementation; chip size; floorplan method; latency; sequence-pair; setup constraints; simulated annealing; Asynchronous circuits; Delays; Layout; Minimization; Registers; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
Conference_Location :
Paris
Print_ISBN :
978-1-4799-0618-5
Type :
conf
DOI :
10.1109/NEWCAS.2013.6573596
Filename :
6573596
Link To Document :
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