Optical packaging of silicon photonic devices for external connection of parallel optical signals

Optical packaging method is necessary for silicon nanophotinic devices. We evaluate various optical connection methods for the silicon photonic transceivers, in terms of connection of waveguides on silicon chips to the external optical cables. An intermediate optical path such as optical waveguides or optical fibers is beneficial to couple the on-silicon optical signals with external fibers for high bandwidth transceiver devices. For the CPU like modules with large bandwidth optical input and output, various requirements such as for electrical and optical connection, accurate module positioning, and cleanliness of the optical interface have to be considered. The dual lens coupling scheme is effective in relaxing these requirements.