• DocumentCode
    628428
  • Title

    3-Axis MEMS accelerometer-based implantable heart monitoring system with novel fixation method

  • Author

    Tjulkins, Fjodors ; Anh Tuan Thai Nguyen ; Hoivik, Nils ; Aasmundtveit, Knut E. ; Andreassen, Erik ; Hoff, Lars ; Imenes, Kristin

  • Author_Institution
    Dept. of Micro & Nano Syst. Technol., Oslo Univ. Hosp., Tonsberg, Norway
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    510
  • Lastpage
    516
  • Abstract
    Existing heart monitoring methods have certain drawbacks such as lack of specificity or inability to perform continuous monitoring. An accelerometer attached to the heart wall can provide a very direct measurement of the heart function. This system could provide monitoring during the surgery and for the period after it. Miniaturization of modern commercial off-the-shelf accelerometers makes it possible to repackage these sensors to serve as an implantable heart monitoring system. The compact size also allows implanting the sensor directly into the heart muscle, which was not possible before. This system was fabricated using a 3-axis accelerometer (CMA3000A01 from Murata Electronics Oy, Finland), a custom designed flexible substrate-cable and silicone encapsulation. In this paper the prototype fabrication process is described, early reports from the ongoing trials as well as some conclusion based on those reports are presented.
  • Keywords
    accelerometers; electrocardiography; encapsulation; microfabrication; microsensors; prosthetics; silicone rubber; surgery; 3-axis MEMS accelerometer-based implantable heart monitoring system; BMA 355 3-axis sensor; ECG; commercial off-the-shelf accelerometers; compact sensors; fabrication process; fixation method; flexible substrate-cable; heart function measurement; heart muscle; silicone encapsulation; silicone rubber; surgery; Accelerometers; Curing; Encapsulation; Heart; Monitoring; Sensors; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575620
  • Filename
    6575620