DocumentCode :
628433
Title :
Substrate reflectivity study for high brightness LED package
Author :
Chieh-Lung Lai ; Song-Chun Wu ; Jui-Feng Lai ; Hsien-Wen Chen
Author_Institution :
Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
541
Lastpage :
545
Abstract :
Luminous efficacy is key performance index for LED package. Conventional LED used plastic compound and silver plating as reflective surface. In this paper, we discussed the relation between roughness and reflectivity and the relation between reflectivity of substrate surface and luminous efficacy. We used aluminum alloy A6063-T5 as LED package substrate. There are three surface treatments - diamond cutting, diamond cutting with anodizing treatment, and blue clay polishing that are used on LED package substrates. From substrate machining results, we found there is no relation between roughness and surface reflectivity. From optical simulation and LED packaging results, we found there is positive relation between substrate reflectivity and luminous efficacy. The reflectivity at 550~600nm dominates the LED luminous efficacy.
Keywords :
aluminium alloys; brightness; cutting; electroplating; light emitting diodes; packaging; reflectivity; substrates; aluminum alloy A6063-T5; anodizing treatment; blue clay polishing; diamond cutting; high brightness LED package substrate; luminous efficacy; optical simulation; plastic compound; reflective surface; roughness; silver plating; size 550 nm to 600 nm; substrate machining; substrate reflectivity study; surface reflectivity; surface treatments; Diamonds; Light emitting diodes; Optical reflection; Phosphors; Reflectivity; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575625
Filename :
6575625
Link To Document :
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