An improved model for predicting fatigue-crack propagation behaviors in multiple solder bumps on a BGA package

A previously developed model for predicting the behavior of fatigue crack propagation in a solder bump on a BGA package has now been improved by switching to the use of a commercial structural analysis code, ADVENTURECluster, which supports large-scale nonlinear finite-element analysis based on parallel processing and the implicit method. The improved model can predict fatigue-crack-propagation behavior in dozens of solder joints in one analysis. The results of testing this improved “modified accumulated damage model” were in good agreement with experimental results, indicating that the improved model can accurately predict the behavior of fatigue crack propagation in multiple solder bumps and predict the fatigue life of each solder bump on a BGA package.