Towards alternative technologies for fine pitch interconnects

Author

Colonna, J.P. ; Segaud, R. ; Marion, F. ; Volpert, M. ; Garnier, A. ; Di Cioccio, L. ; Beillard, Y. ; Mermoz, S. ; de Crecy, F. ; Laviron, C. ; Cheramy, S.

Author_Institution

LETI, CEA, Grenoble, France

fYear

2013

fDate

28-31 May 2013

Firstpage

872

Lastpage

878

Abstract

This study focuses on alternative technologies for fine pitch 3D interconnect. These technologies are: μ-inserts (insertion of a nickel cylinder in Aluminium pad), μ-tubes (insertion of a hard tube in Aluminium pad), Transient Liquid Phase (TLP) bonding (whole solder reacts to form intermetallic compound) and copper direct bonding. In the first part the process flow is described. Then electrical performances are presented, including a comparison of the Kelvin resistance for each technology. The next part presents reliability considerations, where the failure modes and the weaknesses of each interconnect technologies are described. The mechanical impact of insertion technologies is also studied.

Keywords

aluminium; bonding processes; integrated circuit interconnections; integrated circuit reliability; solders; μ-tubes; Al; Kelvin resistance; TLP bonding; aluminium pad; fine pitch 3D interconnect; interconnect technology; intermetallic compound; nickel cylinder; reliability; solder; transient liquid phase; Aluminum; Assembly; Bonding; Copper; Electron tubes; Kelvin; Resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575676

Filename

6575676