Title :
Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies
Author :
Chang-Lin Yeh ; Yung-Yi Yeh ; Jen-Chieh Kao ; Tong Hong Wang ; Chang-Chi Lee ; Ho-Ming Tong
Author_Institution :
Group R&D, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
Abstract :
In this paper, mechanical bonding behaviors of micro-bumps in 2.5D/3D ICs assembly are studied theoretically. Solder force and spring constant of micro-bumps with different bond pad structures are estimated by using Surface Evolver. Deformations of dies with corresponding flattening distances are evaluated based on flexural theory and three-dimensional contact theories. Allowable coplanarity of bond surface or die warpage during both mass reflow and thermal compression bond is developed. Guidelines to ensure successful bond and corresponding structural designs are earned.
Keywords :
deformation; integrated circuit bonding; integrated circuit design; microassembling; solders; three-dimensional integrated circuits; 2.5D IC assembly; 3D IC assembly; bond pad structure; bond surface coplanarity; die deformation; die warpage; flattening distance; flexural theory; mass reflow; mechanical bonding behavior; microbump bondability design guideline; solder force; spring constant; structural design; surface evolver; thermal compression bond; three-dimensional contact theory; Bonding; Equations; Force; Integrated circuits; Shape; Springs; Stacking;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575680
