Title :
Thermally enhanced pre-applied underfills for 3D integration
Author :
Horibe, A. ; Okamoto, K. ; Mori, Hisamichi ; Orii, Y. ; Kawate, Kohichiro ; Takamatsu, Yusuke ; Akiyama, Hidenori
Author_Institution :
IBM Res. - Tokyo, Kawasaki, Japan
Abstract :
One of the biggest challenges for future high-performance three dimensional (3D) integrated devices is heat removal from the stacked dies. In this study, thermally enhanced pre-applied type underfills were studied. These materials were formulated considering fillet cracks and delaminations that appeared in thermal cycling tests on 2D organic package. Finally, the applicability for 3D integration processing with the new material was evaluated on a 3D test vehicle assembly.
Keywords :
assembling; cracks; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; thermal management (packaging); three-dimensional integrated circuits; 2D organic package; 3D integration processing; 3D test vehicle assembly; delamination; fillet cracks; heat removal; high-performance three dimensional integrated devices; stacked dies; thermal cycling test; thermally enhanced preapplied type underfills; Assembly; Silicon; Substrates; Temperature measurement; Thermal conductivity; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575682
