An air-dielectric via structure for 20Gbps+ board connectors

This paper introduces a novel air-dielectric via structure which can improve the interconnect signal bandwidth by reducing the impedance mismatch in vias of high speed system PCBs carrying 20 Gbps+ signals. Design methods of the proposed air-dielectric structure are presented. Using these methods a system target design impedance can be better matched thus causing reductions in the signal degradation caused by the reflections as well as propagation losses.