Title :
Embedded capacitors in the next generation processor
Author :
Yongki Min ; Olmedo, Reynaldo ; Hill, Mark ; Radhakrishnan, Krishnaja ; Aygun, K. ; Kabiri-Badr, Mostafa ; Panat, Rahul ; Dattaguru, Sriram ; Balkan, Haluk
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
Embedded passives technology has been of interest to electronic package designers for performance improvement and package size reduction. With the explosion of mobile phones, tablets and other hand held devices, the need for smaller form factor products with equivalent or better electrical performance makes a very compelling case for embedding passives. The benefits of embedded passives are not limited to small form factor devices. Larger die and server products requiring high performance power delivery solutions can also benefit substantially from embedded capacitors. Intel in collaboration with its suppliers has developed and commercialized a disruptive embedded capacitor technology that provides significant power delivery benefits for high performance computer applications. This is the first commercialized embedded capacitor technology used by Intel.
Keywords :
capacitors; electronics packaging; embedded systems; microprocessor chips; Intel; electronic package designers; embedded capacitors; embedded passives technology; high performance computer applications; next generation processor; small form factor products; Capacitance; Capacitors; Ceramics; Impedance; Inductance; Microprocessors; Substrates;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575731