• DocumentCode
    628646
  • Title

    Wafer-level integration of micro-lens for THz focal plane array application

  • Author

    Kyoung Youl Park ; Wiwatcharagoses, Nophadon ; Chahal, Premjeet

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    1912
  • Lastpage
    1919
  • Abstract
    Design and fabrication of dielectric lenses for terahertz (THz) focal plane arrays are presented in this paper. Lenses are designed using optical lens and ellipsoid function theory in the terahertz range (centered at f = 300GHz). In order to enhance coupling to planar circuits on wafer, two types of lenses are considered: modified hemispherical, such as extended hemispherical and hypo-hemispherical. Full wave analysis of the lens design is carried out both in near- and far-field regimes. The lenses are fabricated using a 3D plastic printer. An approach to use the 3D printed structure as a mold to fabricate micro-injection molded lenses is also introduced. Measured results on 3D printed lens array show high transmission characteristics and measured results correlate closely with simulation results.
  • Keywords
    dielectric materials; focal planes; microlenses; terahertz wave devices; three-dimensional printing; wafer level packaging; wafer-scale integration; 3D plastic printer; 3D printed lens array; dielectric lenses; ellipsoid function theory; extended hemispherical lens; far-field regimes; frequency 300 GHz; full wave analysis; hypo-hemispherical lens; microinjection molded lenses; modified hemispherical lens; near-field regimes; optical lens; planar circuits; terahertz focal plane arrays; Apertures; Arrays; Detectors; Dielectrics; Fabrication; Lenses; Materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575839
  • Filename
    6575839