DocumentCode :
628651
Title :
High frequency DC-DC converter with co-packaged planar inductor and power IC
Author :
Ningning Wang ; Barry, John ; Hannon, J. ; Kulkarni, Santosh ; Foley, Raymond ; McCarthy, K. ; Rodgers, K. ; Waldron, F. ; Barry, Miriam ; Casey, D. ; Rohan, James ; O´Brian, Joe ; Hegarty, Margaret ; Kelleher, Ann-Marie ; Roy, Sandip ; Mathuna, Cian O.
Author_Institution :
Tyndall Nat. Inst., Univ. Coll. Cork, Cork, Ireland
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
1946
Lastpage :
1952
Abstract :
The paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency, form factor reduction and cost reduction. To demonstrate the concept of highly integrated switched mode power supply with integrated magnetic, a system-in-package DC-DC converter using a stacked co-packaging approach is developed. A system approach was taken to the design, and functional integration, using 3-D packaging for realizing a power supply in package solution (PwrSiP). The target integrated converter is capable of handling an input voltage of 5V and frequencies up to 40MHz. A DC-DC converter IC on a 0.35μm CMOS process was designed to meet this goal. In parallel with the IC design, technology development for on-silicon integrated micro-inductors was completed to achieve small-form factor and extremely low profile. A maximum measured efficiency of 83% and 78% was achieved on the stacked converter operating at 20MHz and 40MHz, respectively. The stacked approach showed a 30% area reduction compared to side-by-side implementation with external discrete inductor.
Keywords :
CMOS integrated circuits; DC-DC power convertors; inductors; integrated circuit design; power integrated circuits; system-in-package; CMOS process; DC-DC converter; IC design; PwrSiP; cost reduction; form factor reduction; frequency 20 MHz; frequency 40 MHz; on-silicon integrated micro-inductors; planar inductor; power IC; power converters; power supply in package solution; size 0.35 mum; switched mode power supply; system-in-package; voltage 5 V; Inductance; Inductors; Integrated circuits; Magnetic cores; Resistance; Shift registers; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575844
Filename :
6575844
Link To Document :
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