DocumentCode
628664
Title
Electrical performance modeling of unbalanced comb tree networks on advanced PCB interconnects for high-rate clock signal distribution
Author
Eudes, T. ; Ravelo, B. ; Lacrevaz, Thierry ; Flechet, Bernard
Author_Institution
IRSEEM, Sch. of Eng. ESIGELEC, St.-Etienne du Rouvray, France
fYear
2013
fDate
28-31 May 2013
Firstpage
2024
Lastpage
2034
Abstract
Usually, the routing process is made by non-specialists in electrical simulation that only meet the requirement of the standards. The aim of this work is to supply a new tool dedicated to assess the quality of the tree network routing. An innovative modeling method of advanced unbalanced interconnections called “comb tree” for distributing high speed clock signals is featured. The flow work summarizing the routine process of new design rule is established to enhance the performance of advanced packages for high speed circuits. The analytical approach for extracting the voltage transfer function corresponding to the electrical signal paths in function of tree branch parameters is fundamentally inspired from SIMO/SISO electrical circuit analogy. Doing so, the wideband characteristic impedances and propagation constants of elementary lines constituting the tree are extracted from geometrical and physical properties. A PCB prototype of unbalanced comb tree network over FR-4 substrate has been designed and manufactured for the experimental verification. Then, frequency analyses of different VTFs have been carried out. Less than 1dB of error has been found within the DC-3GHz bandwidth and less than 4 dB within 3-10GHz. In addition, time-domain analyses with 2 Gbps input signal has been realized. Excellent agreements between transient simulations and the proposed model have been established. The model developed is potentially useful for predicting the signal integrity and optimization process of unbalanced advanced PCB and on-chip tree interconnects.
Keywords
clocks; high-speed integrated circuits; integrated circuit design; integrated circuit modelling; printed circuit interconnections; time-domain analysis; trees (electrical); FR-4 substrate; PCB interconnects; SIMO/SISO electrical circuit analogy; bit rate 2 Gbit/s; electrical performance modeling; electrical simulation; frequency 3 GHz to 10 GHz; high speed circuits; high-rate clock signal distribution; on-chip tree interconnects; propagation constants; time-domain analyses; transient simulations; tree network routing; unbalanced comb tree networks; voltage transfer function; wideband characteristic impedances; Admittance; Clocks; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Receivers; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4799-0233-0
Type
conf
DOI
10.1109/ECTC.2013.6575857
Filename
6575857
Link To Document