Graphene heat spreader for thermal management of hot spots

Author

Zhaoli Gao ; Yong Zhang ; Yifeng Fu ; Yuen, Michelle ; Liu, Jiangchuan

Author_Institution

Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Gothenburg, Sweden

fYear

2013

fDate

28-31 May 2013

Firstpage

2075

Lastpage

2078

Abstract

Monolayer graphene was fabricated using thermal chemical vapor deposition (TCVD) as heat spreaders in electronic packaging. Platinum (Pt) thermal evaluation chips were utilized to evaluate the thermal performance of the graphene heat spreaders. Temperature of hot spot driven at a heat flux of up to 430W·cm^-2 was decreased by about 13 °C with the attaching of the graphene heat spreader. We demonstrate the potentials of using CMOS compatible TCVD process to make graphene as heat spreader for power dissipation needs.

Keywords

chemical vapour deposition; graphene; thermal management (packaging); CMOS compatible TCVD process; electronic packaging; graphene heat spreader; heat flux; heat spreaders; hot spots; monolayer graphene; platinum thermal evaluation chips; power dissipation; thermal chemical vapor deposition; thermal management; thermal performance; Electronic packaging thermal management; Graphene; Heating; Materials; Resistance; Temperature measurement; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575865

Filename

6575865