• DocumentCode
    628690
  • Title

    Understanding loss mechanisms of passive interconnects with innovative/cost effective structure implementations for supporting 28Gbps and beyond transmission

  • Author

    Namhoon Kim ; Joong-Ho Kim ; Anderson, Richard ; Wu, Po-Han ; Ramalingam, S.

  • Author_Institution
    Xilinx, Inc., San Jose, CA, USA
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    2179
  • Lastpage
    2182
  • Abstract
    Channel loss budgets are becoming more stringent as operating speeds increase. The loss mechanisms of these high-speed channels need to be properly understood in order to minimize the channel loss. The conductor loss, including skin effect loss and surface roughness loss as well as dielectric loss will be addressed theoretically and practically in various cases. This paper will study and identify which losses are primarily responsible for determining system performance in various cases.
  • Keywords
    dielectric losses; electronics packaging; surface roughness; bit rate 28 Gbit/s; channel loss budgets; dielectric loss; innovative/cost effective structure; loss mechanisms; passive interconnects; skin effect loss; surface roughness loss; Conductors; Dielectric losses; Rough surfaces; Substrates; Surface impedance; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575883
  • Filename
    6575883