DocumentCode
628690
Title
Understanding loss mechanisms of passive interconnects with innovative/cost effective structure implementations for supporting 28Gbps and beyond transmission
Author
Namhoon Kim ; Joong-Ho Kim ; Anderson, Richard ; Wu, Po-Han ; Ramalingam, S.
Author_Institution
Xilinx, Inc., San Jose, CA, USA
fYear
2013
fDate
28-31 May 2013
Firstpage
2179
Lastpage
2182
Abstract
Channel loss budgets are becoming more stringent as operating speeds increase. The loss mechanisms of these high-speed channels need to be properly understood in order to minimize the channel loss. The conductor loss, including skin effect loss and surface roughness loss as well as dielectric loss will be addressed theoretically and practically in various cases. This paper will study and identify which losses are primarily responsible for determining system performance in various cases.
Keywords
dielectric losses; electronics packaging; surface roughness; bit rate 28 Gbit/s; channel loss budgets; dielectric loss; innovative/cost effective structure; loss mechanisms; passive interconnects; skin effect loss; surface roughness loss; Conductors; Dielectric losses; Rough surfaces; Substrates; Surface impedance; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4799-0233-0
Type
conf
DOI
10.1109/ECTC.2013.6575883
Filename
6575883
Link To Document