Title :
Electronic packages for high pressure applications: A dome-shaped cavity design
Author :
Rong, Eric Phua Jian ; Riko, I. Made ; Sharif, Amir ; Wong Chee Cheong ; Zhong, Caijun ; MinWoo, Daniel Rhee ; Gan Chee Lip
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
Abstract :
Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a novel dome shaped cavity design would be discussed. Results show that such methods are viable and are possible alternatives for similar harsh environment applications.
Keywords :
electronics packaging; encapsulation; alternative encapsulation method; dome shaped cavity design; electronic package; harsh environment application; high pressure application; high pressure high temperature environment; thickened base; thickened lid; Cavity resonators; Ceramics; Loading; Ocean temperature; Standards; Strain; Stress;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575911
