DocumentCode
628718
Title
Electronic packages for high pressure applications: A dome-shaped cavity design
Author
Rong, Eric Phua Jian ; Riko, I. Made ; Sharif, Amir ; Wong Chee Cheong ; Zhong, Caijun ; MinWoo, Daniel Rhee ; Gan Chee Lip
Author_Institution
Inst. of Microelectron., Singapore, Singapore
fYear
2013
fDate
28-31 May 2013
Firstpage
2342
Lastpage
2348
Abstract
Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a novel dome shaped cavity design would be discussed. Results show that such methods are viable and are possible alternatives for similar harsh environment applications.
Keywords
electronics packaging; encapsulation; alternative encapsulation method; dome shaped cavity design; electronic package; harsh environment application; high pressure application; high pressure high temperature environment; thickened base; thickened lid; Cavity resonators; Ceramics; Loading; Ocean temperature; Standards; Strain; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4799-0233-0
Type
conf
DOI
10.1109/ECTC.2013.6575911
Filename
6575911
Link To Document