DocumentCode
629127
Title
FDSOI process/design full solutions for ultra low leakage, high speed and low voltage SRAMs
Author
Ranica, R. ; Planes, N. ; Weber, Olivier ; Thomas, O. ; Haendler, S. ; Noblet, D. ; Croain, D. ; Gardin, C. ; Arnaud, F.
Author_Institution
STMicroelectron., Crolles, France
fYear
2013
fDate
11-13 June 2013
Abstract
We propose for the first time a complete SRAM offer in FDSOI technology, covering low leakage, high speed and low voltage customer requirements, through simple and innovative process/design solutions. Starting from a bulk-design direct porting, we evidenced +50% and +200% Iread at Vdd=1V and 0.6V, respectively vs 28LP bulk. Additionally, -100mV Vmin reduction has been demonstrated with 28FDSOI. Alternative flip-well and single well architecture provides further speed and Vmin improvement, down to 0.42V on 1Mb 0.197μm2. Ultimate stand-by leakage below 1pA on 0.120μm2 bitcell at Vdd=0.6V is finally reached by taking the full benefits of the back bias capability of FDSOI.
Keywords
SRAM chips; silicon-on-insulator; FDSOI design; FDSOI process; bulk-design direct porting; high speed SRAM; low voltage SRAM; ultra low leakage SRAM; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSIT), 2013 Symposium on
Conference_Location
Kyoto
ISSN
0743-1562
Print_ISBN
978-1-4673-5226-0
Type
conf
Filename
6576626
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