• DocumentCode
    629127
  • Title

    FDSOI process/design full solutions for ultra low leakage, high speed and low voltage SRAMs

  • Author

    Ranica, R. ; Planes, N. ; Weber, Olivier ; Thomas, O. ; Haendler, S. ; Noblet, D. ; Croain, D. ; Gardin, C. ; Arnaud, F.

  • Author_Institution
    STMicroelectron., Crolles, France
  • fYear
    2013
  • fDate
    11-13 June 2013
  • Abstract
    We propose for the first time a complete SRAM offer in FDSOI technology, covering low leakage, high speed and low voltage customer requirements, through simple and innovative process/design solutions. Starting from a bulk-design direct porting, we evidenced +50% and +200% Iread at Vdd=1V and 0.6V, respectively vs 28LP bulk. Additionally, -100mV Vmin reduction has been demonstrated with 28FDSOI. Alternative flip-well and single well architecture provides further speed and Vmin improvement, down to 0.42V on 1Mb 0.197μm2. Ultimate stand-by leakage below 1pA on 0.120μm2 bitcell at Vdd=0.6V is finally reached by taking the full benefits of the back bias capability of FDSOI.
  • Keywords
    SRAM chips; silicon-on-insulator; FDSOI design; FDSOI process; bulk-design direct porting; high speed SRAM; low voltage SRAM; ultra low leakage SRAM; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2013 Symposium on
  • Conference_Location
    Kyoto
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4673-5226-0
  • Type

    conf

  • Filename
    6576626