Title :
3D IC heterogeneous integration of GPS RF receiver, baseband, and DRAM on CoWoS with system BIST solution
Author :
Liao, W.S. ; Chen, H.N. ; Yen, K.K. ; Yeh, E.H. ; Kuo, F.W. ; Yeh, T.J. ; Kuo, Fei-Ching ; Jou, C.P. ; Liu, Siyuan ; Hsueh, F.L. ; Lin, H.C. ; Peng, C.N. ; Wang, Maximilian J. ; Wu, W.C. ; Hu, S.P. ; Chen, Mayee F. ; Hou, S.Y. ; Jeng, S.P. ; Yu, Cody Hao
Author_Institution :
R&D, Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
Abstract :
A 3D IC heterogeneous chip integration of 65nm RF receiver, 28nm baseband processor, and 40nm DRAM on a proprietary CoWoS structure is demonstrated and its electrical characterization of KGS (Known Good Stack) has revealed a highly comparable system performance as compared to that of the KGD (Known Good Die) testing data. Moreover, an innovative system BIST (Built-in-Self-Test) scheme and methodology have been designed to save screening time by over 90% as compared to that of the conventional ATE full functional test. This work also exhibits an emerging application possibility for all other CoWoS related system integration such as smart mobile devices, smart consumer electronics, remote medical diagnosis and smart car telemetry, etc.
Keywords :
DRAM chips; Global Positioning System; built-in self test; integrated circuit testing; radio receivers; three-dimensional integrated circuits; 3D IC heterogeneous chip integration; ATE full functional test; DRAM; GPS RF receiver; KGD; KGS; baseband processor; built-in-self-test scheme; known good die testing data; known good stack; proprietary CoWoS structure; remote medical diagnosis; size 28 nm; size 40 nm; size 65 nm; smart car telemetry; smart consumer electronics; smart mobile device; system BIST solution; Baseband; Built-in self-test; Global Positioning System; Radio frequency; Random access memory; Receivers; 3D IC; BIST; Baseband; CoWoS; DRAM; GPS;
Conference_Titel :
VLSI Circuits (VLSIC), 2013 Symposium on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-5531-5
