Title :
Dimensioning of Modular High Frequency converter for drives
Author :
Schulz, Markus ; Lambertz, Lukas ; Marquardt, Rainer
Author_Institution :
Inst. of Power Electron. & Control, Univ. der Bundeswehr, Munich, Germany
Abstract :
In order to meet the requirements of future electric drive systems, new converter topologies are investigated. Because light weight is one of the main requirements, the passive components (DC-capacitors, chokes, EMI-filters) have to be reduced drastically [1]. Additional important points are fault tolerance [2], EMI limits and the industrial scalability of the system. These requirements cannot be met with standard topologies [3][4]. The Modular High Frequency converter (MHF) is a new inverter topology for electrical drive systems. It is well adapted to those future requirements, especially ultra-light weight, small volume, low losses, fault tolerance and an excellent dynamic behavior [5][6][7]. In order to optimize the drive system, using a MHF converter, a good adaption of the MHF converter to the parameters of the PM-Machine and vice versa is necessary. This paper deals with the design parameters and presents the dimensioning of the converter for a typical permanent magnet machine. First measurements of a laboratory prototype are depicted and the newest version of the power circuit is shown.
Keywords :
electric drives; electromagnetic interference; fault tolerance; frequency convertors; permanent magnet machines; DC-capacitors; EMI limits; EMI-filters; MHF converter; PM-machine; chokes; converter topology; dynamic behavior; electric drive systems; fault tolerance; inverter topology; modular high-frequency converter dimensioning; passive components; power circuit; typical permanent magnet machine; Choppers (circuits); Coils; Frequency conversion; Integrated circuits; Lead; Low voltage; Tin; MHF; Modular High Frequency Converter; high switching frequency; inverter for drive Systems; low voltage semiconductor; multi-level converter;
Conference_Titel :
ECCE Asia Downunder (ECCE Asia), 2013 IEEE
Conference_Location :
Melbourne, VIC
Print_ISBN :
978-1-4799-0483-9
DOI :
10.1109/ECCE-Asia.2013.6579173