DocumentCode
633227
Title
Prospects and challenges of high-density heterogeneous photonic integration
Author
Yoo, S.J.B.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of California, Davis, Davis, CA, USA
fYear
2013
fDate
June 30 2013-July 4 2013
Firstpage
1
Lastpage
2
Abstract
We will review the progress and impact of photonic integration, and address the progress, challenges, and future prospects of photonic-electronic integration in future information systems. Technologies include silicon CMOS photonics and InP, GaAs OEICs.
Keywords
CMOS integrated circuits; III-V semiconductors; elemental semiconductors; gallium arsenide; indium compounds; integrated optoelectronics; silicon; GaAs; GaAs OEIC; InP; InP OEIC; Si; high-density heterogeneous photonic electronic integration; information systems; silicon CMOS photonics; Bandwidth; CMOS integrated circuits; Integrated optics; Optical device fabrication; Optical transmitters; Photonics; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching (OECC/PS), 2013 18th
Conference_Location
Kyoto
Type
conf
Filename
6597361
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