Title :
Fiber bundle type fan-out for multicore Er doped fiber amplifier
Author :
Watanabe, K. ; Saito, Takashi ; Tsuchida, Yukihiro ; Maeda, Kumiko ; Shiino, Masato
Author_Institution :
FITEL Photonics Lab., Furukawa Electr. Co., Ltd., Chiba, Japan
fDate :
June 30 2013-July 4 2013
Abstract :
We achieved connection loss <; 0.5dB between fiber bundle type fan-out (FBF) and MC-EDF by matching the mode field diameters of each fiber. This low connection loss realized NF improvement about 0.7dB.
Keywords :
erbium; optical communication equipment; optical fibre amplifiers; optical fibre fabrication; optical fibre losses; FBF; MC-EDF; connection loss; fiber bundle type fan-out; mode field diameter matching; multicore erbium doped fiber amplifier; Bonding; Gain; Multicore processing; Noise measurement; Optical fiber amplifiers; Optical fiber communication; Optical losses;
Conference_Titel :
OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching (OECC/PS), 2013 18th
Conference_Location :
Kyoto
