Title :
Electrical properties of low-k dielectric in copper interconnect structures
Author :
Mingte Lin ; Liang, Justin ; Juan, Alfons ; Su, K.C.
Author_Institution :
United Microelectron. Corp., Hsinchu, Taiwan
Abstract :
The electrical properties, leakage current and capacitance, of inter and intra level low-k dielectrics are investigated thoroughly with different voltage bias conditions. The leakage currents show important bias polarity dependence with different conduction mechanisms and have stress effects on different structure designs. The novel nonlinear voltage dependence of inter level low-k capacitance at different temperature is demonstrated for the first time. This nonlinear voltage dependence is very important for capacitance linearity improvement consideration.
Keywords :
capacitance; copper; dielectric properties; electrical conductivity; interconnections; leakage currents; capacitance; capacitance linearity improvement; conduction mechanisms; electrical properties; interconnect structures; interlevel low-k dielectrics; intralevel low-k dielectrics; leakage current; nonlinear voltage dependence; voltage bias conditions; Capacitance; Dielectrics; Electric fields; Leakage currents; Metals; Reliability; Temperature measurement;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599154