Title :
Non-destructive open fault isolation in flip-chip devices with space-domain reflectometry
Author :
Qiu, Wei ; Tan, S.C. ; Tay, M.Y. ; Gaudestad, J. ; Talanov, V.V. ; Wei, M.S.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
Abstract :
Space-domain reflectometry (SDR) utilizing scanning superconducting quantum interference device (SQUID) microscopy is a newly developed non-destructive failure analysis (FA) technique for open fault isolation. Unlike the conventional open fault isolation method, time-domain reflectometry (TDR), scanning SQUID SDR provides a truly two-dimensional physical image of device under test with spatial resolution down to 30 μm [1]. In this paper, the SQUID SDR technique is used to isolate dead open faults in flip-chip devices. The experimental results demonstrate the capability of SDR in open fault detection.
Keywords :
SQUIDs; failure analysis; flip-chip devices; superconducting device testing; time-domain reflectometry; SQUID SDR technique; TDR; flip-chip devices; non-destructive failure analysis technique; nondestructive FA technique; nondestructive open fault isolation; scanning superconducting quantum interference device; size 30 mum; space-domain reflectometry; spatial resolution; time-domain reflectometry; two-dimensional physical image; Decision support systems; Failure analysis; Imaging; Integrated circuits; Radio frequency; SQUIDs; Substrates;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599176
