Title :
Nondestructive analysis solution using combination of lock-in thermography(LIT) and 3D oblique X-ray CT technology
Author :
Seimiya, Naoki ; Watanabe, Toshio ; Ichinomiya, Takashi
Author_Institution :
Marubun Corp., Tokyo, Japan
Abstract :
We developed the non-destructive failure analysis method that is combination of Lock-in thermography (LIT) and high resolution 3D oblique CT. It made possible to complete the total analysis efficiently, because we can distinguish the type of failure by this non-destructive method.
Keywords :
X-ray imaging; computerised tomography; failure analysis; infrared imaging; 3D oblique X-ray CT technology; LIT; lock-in thermography; nondestructive analysis solution; nondestructive failure analysis; Failure analysis; Integrated circuits; Three-dimensional displays;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599177
