Title :
High resolution Magnetic Current Imaging for die level short localization
Author :
Gaudestad, J. ; Gagliolo, N. ; Talanov, V.V. ; Yeh, R.H. ; Ma, C.J.
Author_Institution :
Neocera, LLC, Beltsville, MD, USA
Abstract :
Magnetic Field Imaging (MFI) technology is capable of localize shorts using Magnetic Current Imaging (MCI) technique with a very high spatial resolution [1]. In this paper we demonstrate that a Giant Magneto Resistance (GMR) sensor positioned in close proximity to the front side of a die sample enables MFI to achieve sub micron resolution.
Keywords :
failure analysis; fault location; giant magnetoresistance; integrated circuit reliability; integrated circuit testing; magnetic field measurement; magnetic sensors; magnetoresistive devices; die level short localization; giant magnetoresistance sensor; high resolution magnetic current imaging; magnetic field imaging technology; Decision support systems; Failure analysis; Integrated circuits; Radio frequency; SQUIDs;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599179
