Title :
Study on low silver Sn-Ag-Cu-P alloy for wave soldering
Author :
Junjie Wang ; Xicheng Wei ; Wenqi Zhu ; Jian Wu ; Nianzu Wu
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Univ., Shanghai, China
Abstract :
In recent years, it´s a tendency that many researchers are focusing on low Ag lead-free solder due to high cost of silver. However, it´s inevitable that the oxidation may arise because of higher content of tin, especially in wave soldering. In this study, the melting point, hardness, microstructure, wettability and anti-oxidation property of Sn-0.3Ag-0.7Cu-0.004P solder (SACP) were researched and compared with those of Sn-0.3Ag-0.7Cu (SAC). SACP had better oxidation resistance and poorer wettability than SAC, and their melting characteristics were similar.
Keywords :
copper; oxidation; phosphorus alloys; silver; silver alloys; solders; tin alloys; wave soldering; wetting; antioxidation property; hardness property; low-silver alloy; low-silver lead-free solder; melting characteristics; melting point; oxidation resistance; tin content; wave soldering; wettability property; Lead; Microstructure; Oxidation; Resistance; Soldering; Tin; P; Sn-0.3Ag-0.7Cu; lead-free solder; low Ag;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599206
