FIB fast positioning technology and its application

Author

Lin Xiao-ling ; Zhang Xiao-wen

Author_Institution

Sci. & Technol. on Reliability Phys. & Applic. of Electr. Component Lab., Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China

fYear

2013

fDate

15-19 July 2013

Firstpage

537

Lastpage

541

Abstract

Three kinds of FIB fast positioning technology were studied, including positioning according to the coordinate position, positioning with the help of navigation software, positioning according to optical image. They can be used for different use of purpose. Among them, positioning with the help of navigation software is suitable for invisible metal layer editing with minimum damage on die. At the same time, several cases are given to show how FIB fast positioning technology works.

Keywords

focused ion beam technology; integrated circuit reliability; integrated circuit testing; optical images; FIB fast positioning technology; coordinate position; die damage; focused ion beam; metal layer editing; navigation software; optical image; Design automation; Failure analysis; Integrated circuit reliability; Metallization; Navigation; Radio frequency; Semiconductor device measurement; FIB; circuit edit; positioning technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the

Conference_Location

Suzhou

ISSN

1946-1542

Print_ISBN

978-1-4799-1241-4

Type

conf

DOI

10.1109/IPFA.2013.6599218

Filename

6599218