Title :
FIB fast positioning technology and its application
Author :
Lin Xiao-ling ; Zhang Xiao-wen
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electr. Component Lab., Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China
Abstract :
Three kinds of FIB fast positioning technology were studied, including positioning according to the coordinate position, positioning with the help of navigation software, positioning according to optical image. They can be used for different use of purpose. Among them, positioning with the help of navigation software is suitable for invisible metal layer editing with minimum damage on die. At the same time, several cases are given to show how FIB fast positioning technology works.
Keywords :
focused ion beam technology; integrated circuit reliability; integrated circuit testing; optical images; FIB fast positioning technology; coordinate position; die damage; focused ion beam; metal layer editing; navigation software; optical image; Design automation; Failure analysis; Integrated circuit reliability; Metallization; Navigation; Radio frequency; Semiconductor device measurement; FIB; circuit edit; positioning technology;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599218
