Title :
Optimize design on quantum effect photo-detector array board-level packaging
Author :
Ge, Y.P. ; Guo, F.M. ; Ding, Lixin
Author_Institution :
Lab. of Polarized Mater. & Device, East China Normal Univ., Shanghai, China
Abstract :
Models of quantum effect photo-detector array towards MCM-package is established to systematically study the fatigue life of solder joint under different geometrical sizes, and stress of different material with temperature changed by softwares. Thermal-mechanical simulations are carried out on assembly model in order to positioning SED dissipated in solder joints and carrier during thermal cycles. Different temperature cycling tests are studied the complex warping effect in BGA. The influence of cycle life by different solder diameter and carrier thickness is studied in detail. At the same time, interactive visualization package model and coupling model is created. The heat conduction problem of pad, new TSV (Through Silicon Via) structure design is discussed. The crosstalk of “a hole with four lines” structure of TSV and transmission lines on the carrier is analyzed in details by ADS software.
Keywords :
packaging; photodetectors; three-dimensional integrated circuits; ADS software; BGA; MCM-package; TSV; board-level packaging; carrier thickness; cycle life; fatigue life; heat conduction problem; hole with four lines structure; photodetector array; quantum effect; solder joint; thermal cycles; thermal-mechanical simulations; through silicon via structure; visualization package model; warping effect; Crosstalk; Finite element analysis; Heating; Integrated circuit modeling; Reliability; Stress; Through-silicon vias; Coupling; Crosstalk; MCM; Photo-detector; TSV(Through Silicon Via); Thermal Stress;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599222
