DocumentCode
633900
Title
Successful failure analysis using fault diagnosis tool and product characterization board in BiCMOS technology low yield investigation
Author
Liu, Richard ; Chin, Alvin ; Seah Pei Hong ; Lee Wenfeng
Author_Institution
Syst. on Silicon Manuf. Co. Pte. Ltd., Singapore, Singapore
fYear
2013
fDate
15-19 July 2013
Firstpage
624
Lastpage
627
Abstract
The conventional failure analysis methods are not efficient in analyzing Systems on Chip (SoC) ICs. Electrical failure analysis using a Fault Diagnosis Tool (FDT) and Product Characterization Board can help to precisely localize the defect. Failure analysis of two BiCMOS products using these methods will be demonstrated in this paper. Detail analysis of using these two methods are presented and discussed.
Keywords
BiCMOS digital integrated circuits; failure analysis; integrated circuit reliability; system-on-chip; BiCMOS technology; FDT; SoC IC; conventional failure analysis method; defect localization; electrical failure analysis; fault diagnosis tool; low-yield investigation; product characterization board; systems-on-chip IC; Decision support systems; Failure analysis; Integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location
Suzhou
ISSN
1946-1542
Print_ISBN
978-1-4799-1241-4
Type
conf
DOI
10.1109/IPFA.2013.6599238
Filename
6599238
Link To Document