Title :
A study of the mechanical reliability of a MEMS microphone
Author :
Fang Wenxiao ; Huang Qinwen
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., CEPREI, Guangzhou, China
Abstract :
This paper describes a failure analysis on a commercial MEMS microphone after a test according to the standard of Mil-Std-883. With the help of test and a finite element simulation, we find that the studied MEMS part of the microphone can survive a stress limit above 20000g normal to the diaphragm plane. Under a constant acceleration high to 30000g, the diaphragm breaks and the devices fail.
Keywords :
finite element analysis; micromechanical devices; microphones; semiconductor device reliability; semiconductor device testing; stress effects; Mil-Std-883 standard; commercial MEMS microphone; constant acceleration; failure analysis; finite element simulation; mechanical reliability; stress limit; test; Acceleration; Micromechanical devices; Microphones; Reliability; Silicon; Standards; Stress; MEMS; Mechanical Reliability; Microphone;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599261
