Title :
Fully electrical test procedure for inertial MEMS characterization at wafer-level
Author :
Sisto, A. ; Schwarzelbach, O. ; Fanucci, L.
Author_Institution :
Univ. di Pisa, Pisa, Italy
Abstract :
The fast growth of MEMS technologies for the production of inertial sensors in the last decade makes the characterization at wafer-level very important. In this paper is presented a test setup for measuring electrical and mechanical parameters of capacitive MEMS inertial sensors. The test setup is used in the production for automotive and consumer applications. It is fully electrical (i.e. none of the stimuli to the sensors is mechanical). The core of the test setup is a test algorithm. The design of the test algorithm was aimed at a fast, reliable and repeatable wafer-sort test. With the test setup described in this paper, it is possible to measure electrical and mechanical parameters of inertial sensors with up-to-6 dimensions.
Keywords :
capacitive sensors; integrated circuit testing; micromechanical devices; automotive applications; capacitive inertial sensors; consumer applications; fully electrical test procedure; inertial MEMS characterization; mechanical parameters; test setup; up-to-6 dimensions; wafer-level; wafer-sort test; Accelerometers; Capacitance; Gyroscopes; Mechanical sensors; Micromechanical devices; Resonant frequency;
Conference_Titel :
Ph.D. Research in Microelectronics and Electronics (PRIME), 2013 9th Conference on
Conference_Location :
Villach
Print_ISBN :
978-1-4673-4580-4
DOI :
10.1109/PRIME.2013.6603130