DocumentCode :
634751
Title :
Modeling and calibration of ADP process for inductance calculation with InductEx
Author :
Fourie, Christoff ; Xizhu Peng ; Takahashi, Asami ; Yoshikawa, N.
Author_Institution :
Dept. of Electr. & Electron. Eng., Stellenbosch Univ., Stellenbosch, South Africa
fYear :
2013
fDate :
7-11 July 2013
Firstpage :
1
Lastpage :
3
Abstract :
The AIST advanced process (ADP2), with 9 Nb layers and 1 μm minimum Josephson junction size is currently the most complex low-Tc superconductive integrated circuit fabrication process in operation. With planarization for all layers below the main ground plane, and conductors that may traverse several layers, modeling inductance for numerical calculation requires special attention to the capabilities of the extraction tool. We present specific improvements made to InductEx to model the ADP process, including support for selective layer planarization, multiple ground planes and conductors below a ground plane. We discuss calibration of extracted values to experimental results, and show results for pulse transfer cells with inductive coupling and isolated ground planes.
Keywords :
integrated circuit manufacture; numerical analysis; superconducting integrated circuits; ADP2; AIST advanced process; InductEx; Josephson junction; inductance calculation; inductive coupling; numerical calculation; selective layer planarization; size 1 mum; superconductive integrated circuit fabrication; Couplings; Inductance; Integrated circuit modeling; Niobium; Planarization; Semiconductor device modeling; Superconductivity; ground plane modeling; inductance calculation; inductex; planarization; three-dimensional modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Superconductive Electronics Conference (ISEC), 2013 IEEE 14th International
Conference_Location :
Cambridge, MA
Print_ISBN :
978-1-4673-6369-3
Type :
conf
DOI :
10.1109/ISEC.2013.6604270
Filename :
6604270
Link To Document :
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