• DocumentCode
    63477
  • Title

    Data Placement and Duplication for Embedded Multicore Systems With Scratch Pad Memory

  • Author

    Yibo Guo ; Qingfeng Zhuge ; Jingtong Hu ; Juan Yi ; Meikang Qiu ; Sha, Edwin H-M

  • Author_Institution
    Dept. of Comput. Sci., Univ. of Texas at Dallas, Richardson, TX, USA
  • Volume
    32
  • Issue
    6
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    809
  • Lastpage
    817
  • Abstract
    Scratch pad memories (SPM) are attractive alternatives for caches on multicore systems since caches are relatively expensive in terms of area and energy consumption. The key to effectively utilizing SPMs on multicore systems is the data placement algorithm. In this paper, two polynomial time algorithms, regional data placement for multicore (RDPM) and regional data placement for multicore with duplication (RDPM-DUP), have been proposed to generate near-optimal data placement with minimum total cost. There is only one copy for each data in RDPM, while RDPM-DUP allows data duplication. Experimental results show that the proposed RDPM algorithm alone can reduce the time cost of memory accesses by 32.68% on average compared with existing algorithms. With data duplication, the RDPM-DUP algorithm further reduces the time cost by 40.87%. In terms of energy consumption, the proposed RDPM algorithm with exclusive copy can reduce the total cost by 33.47% on average. When RDPM-DUP is applied, the improvement increases up to 38.15% on average.
  • Keywords
    embedded systems; microprocessor chips; multiprocessing systems; semiconductor storage; RDPM algorithm; RDPM-DUP; data duplication; data placement algorithm; embedded multicore systems; near-optimal data placement; polynomial time algorithm; regional data placement; scratch pad memory; Embedded systems; Hardware; Heuristic algorithms; Multicore processing; System-on-chip; Writing; Data duplication; data placement; embedded systems; multicore; scratch pad memory;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2013.2238990
  • Filename
    6516677