• DocumentCode
    635431
  • Title

    Image-to-Class Dynamic Time Warping for 3D hand gesture recognition

  • Author

    Hong Cheng ; Zhongjun Dai ; Zicheng Liu

  • Author_Institution
    Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    3D Human Computer Interaction (HCI) becomes more and more popular thanks to the emergence of commercial depth cameras. Moreover, hand gestures provide a natural and attractive alternative to cumbersome interface devices for HCI. In this paper, we present an Image-to-Class Dynamic Time Warping (I2C-DTW) approach for 3D hand gesture recognition. Themain idea is that we divide the time-series curve of a 3D hand gesture into various finger combinations, called `fingerlets´, which can either be learned or be set manually to represent each gesture and to capture inter-class variations. Furthermore, the I2C-DTW approach searches for the minimal path to warp two fingerlets, which are fromone test image and the specific class, respectively. Then the gesture recognition is to use the ensemble of multiple image-to-class DTW distance of fingerlets to obtain better performance. The proposed approach is evaluated on two 3D hand gesture datasets and the experiment results show that the proposed I2C-DTW approach significantly improves the recognizing performance.
  • Keywords
    gesture recognition; solid modelling; time series; 3D hand gesture recognition; 3D human computer interaction; I2C-DTW approach; finger combinations; fingerlets; image-to-class dynamic time warping; inter-class variations; multiple image-to-class DTW distance; time-series curve; Feature extraction; Gesture recognition; Heuristic algorithms; Hidden Markov models; Sensors; Three-dimensional displays; Training; 3D Hand Gesture Recognition; Dynamic Time Warping; Fingerlets; Human Computer Interaction; Image-to-Class Distance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multimedia and Expo (ICME), 2013 IEEE International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1945-7871
  • Type

    conf

  • DOI
    10.1109/ICME.2013.6607524
  • Filename
    6607524