Title :
Efficient heat dissipation in optoelectronic transmitter modules using thermally enhanced PCB
Author :
Ukaegbu, I.A. ; Tae-Woo Lee ; Mu-Hee Cho ; Hyo-Hoon Park ; Sangirov, J.
Author_Institution :
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
Abstract :
This work demonstrates the thermal analysis for efficient heat dissipation for optoelectronic transmitter modules. A Teflon-based thermal printed circuit board (PCB) has been designed for packaging the designed and fabricated transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below 40 °C which is apt for reliable signal transmission.
Keywords :
cooling; electronics packaging; integrated optoelectronics; optical design techniques; optical fabrication; optical transmitters; printed circuits; thermal analysis; Teflon-based thermal printed circuit board; chips; heat dissipation; optoelectronic transmitter modules; packaging; performance analysis; reliable signal transmission; thermal analysis; thermally enhanced PCB; Conductivity; Heating; Materials; Reliability engineering; Thermal conductivity; Optical interconnection; crosstalk; multi-chip transmitter module; planar transmitter module; thermal PCB;
Conference_Titel :
Photonics in Switching (PS), 2012 International Conference on
Conference_Location :
Ajaccio
