• DocumentCode
    63622
  • Title

    Threshold Voltage Variations Due to Oblique Single Grain Boundary in Sub-50-nm Polysilicon Channel

  • Author

    Jungsik Kim ; Taiuk Rim ; Junyoung Lee ; Chang-Ki Baek ; Meyyappan, M. ; Jeong-Soo Lee

  • Author_Institution
    Div. of IT Convergence Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
  • Volume
    61
  • Issue
    8
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    2705
  • Lastpage
    2710
  • Abstract
    We investigate the effect of single grain boundary (SGB) with arbitrary angles on the threshold voltage (Vth) variation in sub-50-nm polysilicon (poly-Si) channel devices using 3-D simulation. An SGB in the poly-Si channel causes changes in potential barrier profile resulting in the variation of Vth. As the planar devices scale down to 20-nm, oblique SGB can significantly increase the whole potential barrier profile and cause large Vth variation. However, due to superior gate controllability, the gate-all-around devices show relatively small increase of the conduction energy band, and thus mitigate the Vth variation even in 20-nm poly-Si channel.
  • Keywords
    conduction bands; grain boundaries; nanoelectronics; semiconductor devices; 3D simulation; barrier profile; conduction energy band; oblique single grain boundary; polysilicon channel devices; size 20 nm; threshold voltage variation; Electric potential; Grain boundaries; Logic gates; Nanoscale devices; Silicon; Transistors; Grain boundary (GB); poly-silicon (poly-Si) channel; threshold voltage variation; threshold voltage variation.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2329848
  • Filename
    6840968