• DocumentCode
    636275
  • Title

    Ultrasound stimulus to enhance the bone regeneration capability of gelatin cryogels

  • Author

    Fassina, Lorenzo ; Visai, Livia ; Magenes, G. ; Schelfhout, Jorg ; Bloise, Nora ; Riva, Federica ; Omes, Claudia ; Avanzini, Maria Antonietta ; De Angelis, Maria Gabriella Cusella ; Benazzo, Francesco ; Dierick, Manuel ; Van Hoorebeke, Luc ; Dubruel, Pete

  • Author_Institution
    Dipt. di Med. Molecolare, Univ. of Pavia, Luxembourg, Luxembourg
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    846
  • Lastpage
    849
  • Abstract
    In the present study, gelatin-based cryogels have been seeded with human SAOS-2 osteoblasts. In order to overcome the drawbacks associated with in vitro culture systems, such as limited diffusion and inhomogeneous cell-matrix distribution, this work describes the application of ultrasounds (average power, 149 mW; frequency, 1.5 MHz) to physically enhance the cell culture in vitro. The results indicate that the physical stimulation of cell-seeded gelatin-based cryogels upregulates the bone matrix production.
  • Keywords
    biomedical materials; biomedical ultrasonics; bone; cellular biophysics; gelatin; gels; tissue engineering; bone matrix production; bone regeneration enhancement; cell culture enhancement; cell seeding; diffusion cell-matrix distribution; frequency 1.5 MHz; gelatin cryogel; human SAOS-2 osteoblast; in vitro culture system; inhomogeneous cell-matrix distribution; physical stimulation; power 149 mW; ultrasound stimulus; Bones; Educational institutions; Extracellular; Materials; Proteins; Surface treatment; Ultrasonic imaging; Animals; Bone Regeneration; Cattle; Cell Line, Tumor; Cell Proliferation; Cryogels; Extracellular Matrix; Gelatin; Humans; Hydrogels; Microscopy, Electron, Scanning; Osteoblasts; Porosity; Tissue Scaffolds; Ultrasonics; X-Ray Microtomography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609633
  • Filename
    6609633