• DocumentCode
    636324
  • Title

    Finite element analysis of the contact interface between trans-femoral stump and prosthetic socket

  • Author

    Linlin Zhang ; Ming Zhu ; Ling Shen ; Feng Zheng

  • Author_Institution
    Dept. of Precision Med. Instrum., Shanghai Med. Instrum. Coll., Shanghai, China
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    1270
  • Lastpage
    1273
  • Abstract
    Transfemoral amputees need prosthetic devices after amputation surgery, and the interface pressure between the residual limb and prosthetic socket has a significant effect on an amputee´s satisfaction and comfort. The purpose of this study was to build a nonlinear finite element model to investigate the interface pressure between the above-knee residual limb and its prosthetic socket. The model was three-dimensional (3D) with consideration of nonlinear boundary conditions. Contact analysis was used to simulate the friction conditions between skin and the socket. The normal stresses up to 80.57 kPa at the distal end of the soft tissue. The longitudinal and circumferential shear stress distributions at the limb-socket interface were also simulated. This study explores the influences of load transfer between trans-femoral residual limb and its prosthetic socket.
  • Keywords
    biomechanics; finite element analysis; friction; internal stresses; prosthetics; shear strength; skin; surgery; above-knee residual limb; amputation surgery; circumferential shear stress distribution; contact interface; friction conditions; interface pressure; limb-socket interface; load transfer; longitudinal shear stress distribution; nonlinear boundary conditions; nonlinear finite element analysis; normal stresses; prosthetic devices; prosthetic socket; skin; soft tissue; transfemoral amputees; transfemoral stump; Biological tissues; Bones; Finite element analysis; Load modeling; Prosthetics; Sockets; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609739
  • Filename
    6609739