• DocumentCode
    636334
  • Title

    A mobile SSVEP-based brain-computer interface for freely moving humans: The robustness of canonical correlation analysis to motion artifacts

  • Author

    Yuan-Pin Lin ; Yijun Wang ; Tzyy-Ping Jung

  • Author_Institution
    Swartz Center for Comput. Neurosci., Univ. of California, San Diego, La Jolla, CA, USA
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    1350
  • Lastpage
    1353
  • Abstract
    Recently, translating a steady-state visual-evoked potential (SSVEP)-based brain-computer interface (BCI) from laboratory settings to real-life applications has gained increasing attention. This study systematically tests the signal quality of SSVEP acquired by a mobile electroencephalogram (EEG) system, which features dry electrodes and wireless telemetry, under challenging (e.g. walking) recording conditions. Empirical results of this study demonstrated the robustness of canonical correlation analysis (CCA) to movement artifacts for SSVEP detection. This demonstration considerably improves the practicality of real-life applications of mobile and wireless BCI systems for users actively behaving in and interacting with their environments.
  • Keywords
    biomedical electrodes; biomedical telemetry; brain-computer interfaces; electroencephalography; gait analysis; medical signal processing; visual evoked potentials; wireless sensor networks; EEG; SSVEP signal quality; canonical correlation analysis; dry electrodes; freely moving humans; mobile SSVEP-based brain-computer interface; mobile electroencephalogram system; motion artifacts; steady-state visual-evoked potential; walking; wireless telemetry; Accuracy; Correlation; Electroencephalography; Integrated circuits; Legged locomotion; Mobile communication; Signal to noise ratio;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609759
  • Filename
    6609759