Title :
Bone marrow perfusion of proximal femur varied with BMD—A longitudinal study by DCE-MRI
Author :
Ma, Heather T. ; Haiyan Lv ; Griffith, James F. ; Jing Yuan ; Ping-Chung Leung
Author_Institution :
Dept. of Electron. & Inf. Eng., Harbin Inst. of Technol. Shenzhen Grad. Sch., Shenzhen, China
Abstract :
This study investigated bone marrow perfusion at proximal femur varying with bone mineral density (BMD) and aging over 4 years. Dynamic contrast enhanced MRI data was extracted pixel-by-pixel and classified into 3 patterns to indicate the perfusion function. Eighty-seven elderly females were involved. A notable reduced perfusion as a whole was observed in osteoporotic subjects. Moreover, perfusion distribution varies as BMD decreases, especially at the area crossing the femoral neck to the shaft. Consistent for all subjects, the perfusion decreases significantly from the lesser trochanter to the greater trochanter. Further, the subjects with good bone marrow perfusion would keep stable BMD after 4 years, while for those with bad perfusion, their BMD consistently decreased over 4 years. The results indicated that the bone marrow perfusion function interacts with bone modeling and could have a long term effect on BMD. A good perfusion function would help to keep the bone health.
Keywords :
biomedical MRI; bone; diseases; feature extraction; geriatrics; haemorheology; image classification; medical image processing; physiological models; BMD effect; DCE-MRI; aging effect; bone health; bone marrow perfusion function; bone mineral density effect; bone modeling; dynamic contrast enhanced MRI data extraction; elderly female; femoral neck area; greater trochanter; lesser trochanter; longitudinal study; osteoporotic subject; pattern classification; perfusion distribution variation; pixel-by-pixel extraction; proximal femur; shaft area; time 4 year; Aging; Arteries; Bones; Imaging; Minerals; Osteoporosis;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6610074