Title : 
Emergency life support system aiming preprimed oxygenator
         
        
            Author : 
Isoyama, Takashi ; Ariyoshi, Keisuke ; Nii, Koji ; Saito, Ichitaro ; Fukunaga, Kaori ; Inoue, Yasuyuki ; Ono, Takahito ; Ishii, Kazuki ; Hara, Satoshi ; Imachi, Kou ; Takai, Mineo ; Abe, Y.
         
        
            Author_Institution : 
Grad. Sch. of Med., Univ. of Tokyo, Tokyo, Japan
         
        
        
        
        
        
            Abstract : 
Development have been achieved of a new blood pump for next generation Percutaneous Cardio-Pulmonary Support (PCPS) system and a novel surface coating method for silicone membrane hollow fiber by physical adsorption using a copolymer composed of a 2-Methacryloyloxyethyl phosphorylcholine (MPC) unit and a hydrophobic unit. The new blood pump, named the Troidal Convolution Pump (TCP), is based on the principle of a cascade pump and perfused 5 L/min and 350 mmHg at 2450 rpm. The novel copolymer composed of 30% MPC unit and 3-(methacryloyloxy) propyltris (trimethylsiloxy) silane (MPTSSi) unit (PMMSi30) was the most suitable molecular design on a silicone surface. The PMMSi30 coated surface adsorbed 7.2 % as much protein a non-coated surface adsorbed.
         
        
            Keywords : 
biomedical equipment; biomedical materials; blood; coatings; membranes; patient treatment; polymer blends; polymer films; pumps; 2-methacryloyloxyethyl phosphorylcholine; 3-(methacryloyloxy)propyltris(trimethylsiloxy)silane; MPC unit; MPTSSi unit; PMMSi30; TCP; Troidal Convolution Pump; blood pump; cascade pump principle; copolymer; emergency life support system; hydrophobic unit; next generation PCPS system; percutaneous cardiopulmonary support system; physical adsorption; preprimed oxygenator; pressure 350 mm Hg; silicone membrane hollow fiber; surface coating method; Adsorption; Blood; Coatings; Optical fiber devices; Plasmas; Proteins; Surface treatment;
         
        
        
        
            Conference_Titel : 
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
         
        
            Conference_Location : 
Osaka
         
        
        
        
            DOI : 
10.1109/EMBC.2013.6610852