DocumentCode
637626
Title
Femtosecond precision via RF Backplane in MTCA crates
Author
Czuba, K. ; Lysiuk, Anna ; Barmuta, Pawel ; Lesniak, Tomasz ; Ludwig, F. ; Schlarb, H. ; Jezynski, Tomasz ; Barmuta, Pawel
Author_Institution
Inst. of Electron. Syst., Warsaw Univ. of Technol., Warsaw, Poland
fYear
2013
fDate
20-22 June 2013
Firstpage
113
Lastpage
117
Abstract
Modern accelerator control systems based on MTCA.4 platform require femtosecond synchronization of RTM cards containing analog front-end electronics for high-speed digital signal processing AMC cards. The main challenge in such system was to realize distribution of few tens of high-quality RF signals to and between RTM cards with high reliability. Usage of coaxial cables with RF connectors in relatively small area of RTM front panels lead to difficulties with fitting all cables and to ground loop problems. Cable based distribution significantly affected system reliability and was prone to errors during installation. A concept of RF Backplane was developed for MTCA.4 system to distribute high-precision clock, and RF phase reference signals together with managed high analog quality power supply to RTM cards. It also allows for world´s first solution with hot-swap on RF signals. In this paper RF Backplane conception is described together with study on performance limits.
Keywords
accelerator control systems; clocks; coaxial cables; digital signal processing chips; electric connectors; integrated circuit reliability; power supply circuits; synchronisation; AMC cards; MTCA crates; MTCA.4 platform; RF backplane; RF connectors; RF phase reference signals; RTM cards; accelerator control systems; analog front-end electronics; coaxial cables; femtosecond precision; femtosecond synchronization; ground loop problems; high-precision clock; high-speed digital signal processing; installation; power supply; reliability; Backplanes; Connectors; Jitter; Power supplies; RF signals; Radio frequency; Standards; LLRF; MTCA.4; RF Backplane; XFEL; jitter;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits and Systems (MIXDES), 2013 Proceedings of the 20th International Conference
Conference_Location
Gdynia
Print_ISBN
978-83-63578-00-8
Type
conf
Filename
6613324
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