Title :
Influence of Scaling on IC Temperature in FinFET Microprocessor Technologies
Author :
Janicki, Marcin ; Zajac, Piotr ; Szermer, Michal ; Napieralski, A.
Author_Institution :
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
Abstract :
This paper analyses the influence of technology migration on temperature of integrated circuit manufactured in FinFET technologies. The problem is discussed based on the results of thermal simulations obtained for two microprocessors manufactured in different technologies.
Keywords :
MOSFET circuits; integrated circuit design; microprocessor chips; scaling circuits; FinFET technologies; IC temperature; microprocessor technologies; scaling; thermal simulations; Bridge circuits; Bridges; Density measurement; Integrated circuit modeling; Power dissipation; Power system measurements; Program processors; Many-core architectures; technology migration; thermal simulation;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2013 Proceedings of the 20th International Conference
Conference_Location :
Gdynia
Print_ISBN :
978-83-63578-00-8
