DocumentCode
63818
Title
Investigation into the eroding dry-band arcing of filled silicone rubber under DC using wavelet-based multiresolution analysis
Author
Ghunem, R. ; Jayaram, S. ; Cherney, E.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
Volume
21
Issue
2
fYear
2014
fDate
Apr-14
Firstpage
713
Lastpage
720
Abstract
This paper describes an investigation into the dry-band arcing mechanism leading to erosion of filled silicone rubber in the DC inclined plane test. Good correlation is obtained between the formation of surface residue, hotspots and the eroding dry-band arcing. The hotspots detected by infrared camera correlates well with the temperature of degradation determined by thermogravimetric analysis and differential scanning calorimetry. To characterize the physical mechanism of dry-band arcing, wavelet-based multiresolution analysis up to seven levels of resolution is applied to the leakage current waveforms. The analysis shows that both stable and intense discharges characterize the eroding dry-band arcing. A time-to-eroding parameter is proposed to determine the relative resistance to the formation of residue. Faster accumulation of residue is evident under -DC than +DC. Earlier inception of erosion is obtained for the silica filled- as compared to the alumina tri-hydrate filled- silicone, in which the release of the water of hydration is postulated to suppress the residue formation.
Keywords
arcs (electric); differential scanning calorimetry; electric resistance; erosion; infrared detectors; leakage currents; silicone rubber; silicone rubber insulators; waveform analysis; DC inclined plane test; correlation method; differential scanning calorimetry; discharge characterisation; eroding dry band arcing mechanism; filled silicone rubber; filled silicone rubber erosion; hotspots detection; hotspots formation; infrared camera; leakage current waveforms; relative resistance determination; surface residue formation; thermogravimetric analysis; time-to-eroding parameter; wavelet-based multiresolution analysis; Correlation; Discharges (electric); Materials; Multiresolution analysis; Rubber; Temperature measurement; HVDC insulation; Inclined plane test; alumina trihydrate filler; dry band arcing; erosion; hotspot; multiresolution analysis; residue; silica filler; silicone rubber; wavelet transform;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2013.004018
Filename
6783065
Link To Document