• DocumentCode
    638806
  • Title

    Feasibility analysis of a pressure sensitive rubber - based tactile sensor

  • Author

    Jian Guo ; Shuxiang Guo ; Yue Gao ; Wei Wei ; Yuehui Ji ; Yunliang Wang

  • Author_Institution
    Sch. of Electr. Eng., Tianjin Univ. of Technol., Tianjin, China
  • fYear
    2013
  • fDate
    4-7 Aug. 2013
  • Firstpage
    129
  • Lastpage
    134
  • Abstract
    In order to ensure the safety of the MIS (minimally invasive surgery), the pressure sensitive rubber has been proposed to be used in robotic catheter system as the tactile sensor. The contact force between the catheter and the blood vessel wall can be obtained precisely in this way. However, the structure of the blood vessel wall is thin film. Whether the vascular wall will be damaged or not is related to the contact force and the contact area. In this paper, the research of the piezoresistive characteristics of the carbon black filled pressure-sensitive conductive composite material have been carried out, and the relationship between the resistance and the contact area is deduced. Then experiments are designed to draw the relationship curve of the resistance and the contact area. A two-dimensional calibration curve is obtained utilizing the calibration system. Meanwhile, the experimental results indicate that the pressure sensitive rubber can be effectively used as the tactile sensor in robotic catheter system.
  • Keywords
    calibration; carbon; filled polymers; piezoresistance; rubber; tactile sensors; C; carbon black filled pressure-sensitive conductive composite material; contact area; feasibility analysis; piezoresistive characteristics; pressure sensitive rubber; resistance; tactile sensor; two-dimensional calibration curve; Catheters; Equations; Force; Mathematical model; Resistance; Rubber; Tactile sensors; Contact area; Piezoresistive characteristics; Pressure sensitive rubber; Tactile sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2013 IEEE International Conference on
  • Conference_Location
    Takamatsu
  • Print_ISBN
    978-1-4673-5557-5
  • Type

    conf

  • DOI
    10.1109/ICMA.2013.6617905
  • Filename
    6617905