DocumentCode :
638816
Title :
Wearable stooping-assist device in reducing risk of low back disorders during stooped work
Author :
Ziguo Luo ; Yong Yu
Author_Institution :
Dept. of Autom., Univ. of Sci. & Technol. of China, Hefei, China
fYear :
2013
fDate :
4-7 Aug. 2013
Firstpage :
230
Lastpage :
236
Abstract :
Stooped postures are commonly found in agricultural, construction, mining, and other workplaces all around world, and such workers are estimated to be in the 100s of millions worldwide. The work requiring stooped postures is strongly associated with high incidence of low back disorders (LBDs). According to biomechanics, the ideal static equilibrium model of stooped human body was established. A wearable stooping-assist device (WSAD) was developed as an intervention to reduce thoracic and lumbar erector spinae activity, based the model. Electromyography (EMG) experiments were conducted to evaluate the effectiveness of the WSAD. Results showed that the integrated EMG amplitudes of the thoracic erector spinae (TES), the lumbar erector spinae (LES), the latissimus dorsi (LD) and the rectus abdominis (RA) were reduced by 42%, 47%, 28% and 9% respectively, when sagittal trunk bended forward to 90 degrees from the vertical. By reducing back erector spinae activity, the WSAD is able to reduce low back physical demands during stooped work task thereby decreasing the risk of developing LBDs associated with stooped work.
Keywords :
biomechanics; labour resources; occupational safety; risk analysis; safety devices; biomechanics; latissimus dorsi; low back disorders; lumbar erector spinae reduction; rectus abdominis; risk reduction; sagittal trunk; stooped postures; stooped work; thoracic erector spinae reduction; wearable stooping-assist device; workers; Back; Batteries; Biological system modeling; Electromyography; Force; Lithium; Muscles; Biomechanics; Electromyography; Low back disorders; Stooped work; Wearable stooping-assist device;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mechatronics and Automation (ICMA), 2013 IEEE International Conference on
Conference_Location :
Takamatsu
Print_ISBN :
978-1-4673-5557-5
Type :
conf
DOI :
10.1109/ICMA.2013.6617923
Filename :
6617923
Link To Document :
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