Microstrip transmission lines and antennas on Molded Interconnect Devices materials

Author

Unnikrishnan, Divya ; Kaddour, Darine ; Tedjini, Smail

Author_Institution

LCIS Lab., Grenoble Inst. of Technol. (Grenoble INP), Valence, France

fYear

2013

fDate

2-5 Sept. 2013

Firstpage

1

Lastpage

4

Abstract

In this paper, microstrip transmission lines and antennas realized on Molded Interconnect Devices (MIDs) are presented. Measurements of two transmission lines realized by LDS on LCP vectra E820i substrate and inkjet printing on ABS PC substrates allowed the extraction of LCP vectra E820i and ABS PC permittivities. Measurement results show that lower losses are obtained with the LDS fabrication technique, validating thus the potential of MIDs for RF applications. The measurement results of the two microstrip patch antennas realized by Laser Direct structuring (LDS) on LCP vectra E820i substrate and inkjet printing on ABS PC substrate are made in good agreement with simulations.

Keywords

ink jet printing; microstrip antennas; permittivity; transmission lines; ABS PC permittivity; ABS PC substrate; LCP vectra E820i substrate; LDS fabrication technique; MID; RF application; inkjet printing; laser direct structuring; microstrip patch antenna; microstrip transmission line; molded interconnect device; Antenna measurements; Microstrip; Microstrip antennas; Power transmission lines; Printing; Substrates; Transmission line measurements; Antennas; Conductive losses; Ink Jet Printing; Laser Direct Structuring (LDS); Microstrip line; Molded Interconnect Device (MID);

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium (MMS), 2013 13th Mediterranean

Conference_Location

Saida

Type

conf

DOI

10.1109/MMS.2013.6663072

Filename

6663072