• DocumentCode
    643833
  • Title

    Breaking through the BRICs, Part 1

  • Author

    Maynard, Mark ; Bai, Lin

  • Author_Institution
    SIEMIC Inc., Milpitas, CA, USA
  • fYear
    2013
  • fDate
    7-9 Oct. 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The emergent markets in Brazil, Russia, India and China, popularly referred to by the acronym BRIC, now are responsible for a growing portion of the profits for most global companies. Working against this prize is a formidable maze of culture, laws, and overlapping regulations, causing confusion surrounding the regulatory requirements. For those considering entering the BRIC marketplace with electrical and electronic products, knowledge of how to obtain the necessary approvals is needed. Preparation is paramount to face the distinct and unique obstacles that will be encountered. Distance, language, unfamiliar local business norms, and unsophisticated commercial market conditions can sometime make this a difficult and expensive procedure for the uninformed. In Part 1 of this paper, covering Brazil and Russia, we will reveal all the regulatory compliance players in this game for these two countries: the government agencies, the standards, the confounding bureaucracies, and some of the key unwritten rules in these emerging markets, and help product developers and manufacturers to access this massive group of desirable customers, navigating clear pathways to marketing their electronic products.
  • Keywords
    electronic products; globalisation; industrial economics; manufacturing industries; regulation; standards; BRIC; Brazil; China; India; Russia; electronic products; global companies; government agencies; manufacturers; markets; regulations; standards; Certification; Companies; Electromagnetic compatibility; Laboratories; Product safety; Telecommunications; Wireless communication; BRIC; Brazil; Certification; China; Compliance; Emerging Markets; India; Russia;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Product Compliance Engineering (ISPCE), 2013 IEEE Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4673-2941-5
  • Type

    conf

  • DOI
    10.1109/ISPCE.2013.6664162
  • Filename
    6664162